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Heat dissipation from high power microelectronic devices is continuously rising due to their increasing functionality and demands. New cooling technologies are emergently sought to address to the requirement for effective heat dissipation capabilities. For this, compact and functional devices involving boiling heat transfer are needed so that research has been focused on boiling heat transfer on new generation structured surfaces. The aim of the talk will be to discuss about recent advances in this field and research efforts of the speaker related to this subject. In the second part of the talk, the focus will be on cavitating flows in microfluidic systems with structured surfaces. Biomedical, energy and nanoparticle applications of hydrodynamic cavitation will be included in the talk along with research results and contributions of the speaker in this field.